Technical Articles

Adhesive & Mold Curing:

  • IEEE_10 “Low Warpage Flip-Chip Under-Fill Curing”, IEEE Trans. Comp. Pack. Manuf. Tech., 2010.
  • IMAPS_11 “Interactions between Variable Frequency Microwave Underfill Processing and High Performance Packaging Materials”, IMAPS 2011, IBM.
  • IEEE_13 “Void-Free Underfill Process With Variable Frequency Microwave for Higher Throughput in Large Flip Chip Package Application”, IEEE Trans. Device Materials Reliability, 2013, IBM.
  • JAPS_16 “Low temperature cure of epoxy thermosets attaining high Tg using a uniform microwave field”, J. App. Polym. Sci., 2016
  • SMTA_16 “The Dynamics of Low Stress Epoxy Curing”, SMTA International, Chicago, 2016.

Dielectric Film Curing:

  • SOP_6 “Low Temperature Cure of PBO Films on Wafers”, Symposium on Polymers in Microelectronics, 2006.
  • IEEE_7 “Variable Frequency Microwave and Convection Furnace Curing of Polybenzoxazole Buffer Layer for GaAs HBT Technology”, IEEE Trans. Semicon. Manufact., 2007.
  • Matsutani Paper “Low Temperature Curing of Polyimide Precursors by Variable Frequency Microwave” by Matsutani,
  • IWLPC_12 “Reduced Stress and Improved 2.5/3D IC Process Compatibility with Stable Polyimide Dielectrics”, International Wafer Level Packaging Conference, 2012.
  • SOP_12 “Rapid Cure of Polyimide Coatings for Packaging Applications using Variable Frequency Microwave Irradiation”, Symposium on Polymers in Microelectronics, 2012.
  • SOP_14 “Properties and Characteristics of HD4100 PSPI Cured at 250°C with Microwaves”, Symposium on Polymers for Microelectronics, 2014.

Life and Food Sciences:

Industrial Application: