Advanced Thermal Solutions
Curing Applications Questionnaire
Feasibility Request
PLEASE COMPLETE THIS FORM TO HELP US SERVE YOU BETTER
How did you learn of Lambda Tech?
Website
Magazine advertisement or article
Referal
Other
Given Name
Surname
Title
Company Name
Office Phone:
Mobile Phone / Pager:
Email Address:
Street address
City
State
Postal Code
Province
Country
Please check appropriate box to describe your curing appliction
Flip Chip Underfill
Die attach
Continuous web/flow
Glob top
Coatings
Optoelectronic/Fiber Optic
Structural
Potting
Wafer level
Smart cards
If continuous web please specify
feet
inches
per
minute
hour
Other (please describe)
Current process problem or objective
(please describe)
Please describe current
cure conditions
Gel stage?
yes
no
If yes, gel temp of
degrees C for
minutes.
Dispensing method
Name and brand of epoxy (material)
Oven currently used:
Batch
Conveyor (belt)
Vertical
Environment oven used in:
Production
Laboratory
Cleanroom
If in cleanroom,
please specify cleanroom rating:
None
Class 100,000
Class 10,000
Class 1,000
Class 100
Class 10
Class 1
ppm
Throughput information:
Current:
UPH Target:
UPH
Machine utilization:
hours/day
days/week
weeks/year
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