November 26 , 2001

Picolight Selects Lambda Technologies Rapid MicroCure System
Manufacturer of laser-based transmitter/receiver (transceiver) subsystems benefits from VFM technology.

November 26, Boulder, CO- Picolight, a leader in the manufacture and design of laser-based transmitter/receiver (transceiver) subsystems, has selected Lambda Technologies and Variable Frequency Microwave Technology (VFM) as a tool in the development of vertical-cavity surface-emitting laser (VCSEL)-based products.

Multi-channel, parallel optical transmitter and receiver VCSEL array devices have been challenging to produce, and alignment accuracy must be maintained on each channel down to just a few microns. Using Lambda Technologies' Variable Frequency Microwave(VFM), curing techniques, Picolight realizes improved optics alignment and greater yields.

"The Rapid MicroCure system from Lambda Technologies enables us to accelerate our prototyping process at a faster rate than conventional heat methods," said Paul Streit, Picolight director of program management. "The Lambda microwave further allows us to achieve more precise alignment of optics in the curing process. We are satisfied with the microwave's performance and with Lambda's customer service and support"

"VFM greatly accelerates adhesive curing, thereby locking components in place and leading to higher yields. The benefits to Picolight's production have been significant" said Dr. Bill Geisler, Project Manager for Lambda Technologies.

For many of the same reasons mentioned above, VFM can also be used in ferrule attach, fiber array attach, and DWDM-to-fiber block assembly processing. It has also been realized that VFM's volumetric heating can cure adhesives quickly and uniformly. Convective heating on the other hand cures adhesives from the surface inward which ultimately contributes to component misalignment and stress generation. VFM is capable of curing the adhesive up to 10X faster than convection ovens, which reduces the viscous flow time of the adhesive thereby reducing part movement when compared to conventional cure methods.

Advanced packaging and assembly applications include post-mold cure, cavity dam & fill, glob-top, BGA and flip chip underfill, for die-attach, wafer processing, chip-on-board/direct chip-attach, optical component and fiber optic assemblies.