Rapid and Effective Bakeout Approach for Moisture Sensitive Devices

Variable Frequency Microwave (VFM) Processing

Structural Bonding

Flip Chip Underfill & Bump Cure

Glob Top & Potting Cure

Large Area Die Attach

Opto-electronics

Potting Applications

VFM Hybrid Heating

Chip-on-Flex Cure

Glass Lens to Plastic Housing for Seal

Smart Card Assemblies

Fiber Optic Application Note